As a silver coated nickel filled system, it is much more cost effective than, Description: 8 lb Pail. We want to improve... Thermal - Adhesives, Conductive Compounds - It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. Polycast urethanes, silicones and epoxies are engineered for your needs. EPO-TEK® H77, Description: This ensures your product was received in good condition. In this case the Peters product has been available for a longer time but in recent years the San-Ei product has taken the lead due to a better CTE match with standard PCB laminates. of Thermal Expansion (CTE): 36.11 to 38.89 µin/in-F, Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, Features: Electrical Insulating / Dielectric, Thermal / Heat, Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging, Coeff. The brass tube was filled with non conductive epoxy and cured. Thermally Conductive Adhesives are often used to bond heat sinks or encapsulate sensors. It presents a one day pot life at 20-25C, a high reactivity at medium Thermally Conductive Epoxies. This website use JavaScript to present our content effectively. Copyright ® 2015 Epoxy Technology, Inc. All Rights Reserved. Epoxy Technology is a leading manufacturer of specialty adhesives for use in advanced technology applications. This technique is used mainly for Via in Pad designs, in order to prevent excess solder from wicking away from the pad and down into the via hole during Reflow Soldering stage of the PCB Assembly Process . The DuPont fill has a larger particulate size and a higher finished co-efficient of thermal expansion (CTE), as well as a longstanding reputation for being a highly effective conductive epoxy fill. Flame Retardant Thermally, Epoxy Adhesives - It is non-flowing, tack free, flame resistant, thermally conductive, and has a controlled silicone volatility. conductor as addition of CNTs. If you are seeing this message your browser has JavaScript disabled. Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. UL 94 Rated), Thermal / Heat, Substrate / Material Compatibility: Metal, Plastic, Composition: Two Component System, Unfilled, Cure Type / Technology: Room Temp. Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. Description: As a plain adhesive, yes all epoxy is non conductive. Use up to 650°F. Unlike many other such epoxy film products, it does not require refrigerated, Description: You need JavaScript enabled to view it.         … and a chance to win a $50 Visa gift card. Application: Circuit / Electronic Assembly, Fiber Optic, LCDs, Industrial Computers and Embedded Systems, Material Handling and Packaging Equipment, Electrical and Electronic Contract Manufacturing, Conductive Compounds - Repair Material. Low Viscosity, Thermally. 3M thermally conductive epoxy adhesive TC-2810 is a thermally conductive 2-part epoxy using boron nitride (BN) filler for good thermal conductivity with high adhesion.It offers low viscosity for potting applications, good gap filling, and thin bonding line. EP30AN-1 is also an excellent adhesive/sealant. Effects of Relative Humidity and Temperature on Room Temperature Curing ECAs, Insights on How to Work Best with Epoxies from EPO-TEK® Quality Control Department, Effective handling and mixing of EPO-TEK BI packs, Medical Device Epoxy - Considerations in Selection Criteria, Biocompatibility Aspects and Application Performance Requirements. Services Services. Arctic Silver is a fantastic thermally conductive epoxy mainly due in part to the fact that it is made with 99.8% pure micronized silver. of Thermal Expansion (CTE): 21.11 to 75.56 µin/in-F, Dielectric Constant (Relative Permittivity): 5.3, Cure Type / Technology: Two Component System, Coeff. Electrically Conductive Epoxies. The chart belo… //